E6E11 : What is a characteristic of DIP packaging used for integrated circuits?
A
Extremely low stray capacitance (dielectrically isolated package)
B
Extremely high resistance between pins (doubly insulated package)
C
Two chips in each package (dual in package)
D
Two rows of connecting pins on opposite sides of package (dual in-line package)
Correct Answer: Two rows of connecting pins on opposite sides of package (dual in-line package)